Attribute	Description
Material Structure	4-layer composite: Static-dissipative polyethylene (outer layer) / Aluminum shielding / Polyester (middle layer) / Static-dissipative coating (inner layer) 2 4 . Optimized for surface resistance control.
Surface Resistance	≤10¹² Ω/sq (anti-static range) 3 5 , compliant with ANSI/ESD S541 and IEC 61340-5-1 standards.
Certifications	ISO 9001, ISO 14001 2 , and RoHS/REACH compliance 7 . Suitable for electronics in EPA (ESD Protected Areas) 4 .
Barrier Properties	Moisture-resistant (WVTR ≤5 g/m²·24h at 38°C/90% RH) 2 4 ; moderate oxygen barrier (OTR ≤50 cm³/m²·day).
Design Features	Octagonal bottom for stability; heat-sealable or zip-lock closure 2 8 ; customizable print area for branding.
Applications	PCB, RAM, motherboards, IC chips, and other ESD-sensitive components 1 4 9 .
Sustainability	Recyclable polyethylene layers; optional biodegradable additives 8 .

Parameter	Specification
Thickness Range	0.08–0.15 mm (customizable for lightweight to heavy-duty electronics) 2 4 .
Dimensions	Width: 100–400 mm; Height: 150–600 mm; Bottom gusset: 50–150 mm 4 8 .
Tear Resistance	≥35 N (machine direction) / ≥30 N (transverse direction) 3 7 .
Seal Strength	5–8 N/15mm (heat-sealable at 120–140°C) 2 8 .
Static Dissipation	Surface resistance: 10⁶–10¹² Ω/sq 3 5 ; ESD shielding energy ≤30 nJ 4 .
Printing Options	4-color flexographic printing (±0.2 mm accuracy) 8 ; supports QR codes and GS1 barcodes 2 .
Temperature Range	-40°C to 85°C (suitable for cold chain and industrial environments) 4 9 .
MOQ & Lead Time	MOQ 50,000 units; production lead time: 15–25 days 2 8 .